HIGH-PERFORMANCE SMT & INDUSTRIAL SOLDER PASTES

Industrial Solder Paste Manufacturer
Leaded & Lead-Free

Best Solder Paste

Product Overview

Choice Solder manufactures high-performance solder pastes engineered for SMT assembly, BGA components, and precision PCB manufacturing. Our solder pastes deliver excellent printability, controlled slump behavior, stable viscosity, and superior wetting performance for consistent reflow soldering results

Controlled slump performance
Excellent stencil release
High spread factor
Stable melting characteristics
Minimal voiding in BGA and thermal pads

Available Alloy Compositions

Precision-engineered solder paste alloys for modern electronics manufacturing.

Lead-Free Solder Wires

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ROHS Compliant - Solders

SAC 305 (Sn96.5 Ag3.0 Cu5)

Technical Highlights:
• Solidus: 217°C
• Liquidus: 221°C
• Excellent Wetting Performance
• Low Voiding in BGA Applications
• RoHS Compliant

SAC 0307 (Sn99 Ag0.3 Cu0.7)

Technical Highlights:
• Solidus: 217°C
• Liquidus: 221°C
• Reduced Silver Content
• Stable Copper Control
• Cost-Effective Lead-Free Option

Leaded Solder Wires

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63/37 (Sn63 Pb37)


Technical Highlights:
• Melting Point: 183°C (Eutectic)
• Density: ~8.42 g/cm³
• Controlled impurity level ≤ 0.04%
• Excellent spread factor (>95%)
• Smooth wetting and strong joint formation

60/40 (Sn60 Pb40)

Technical Highlights:
• Melting Range: 183–189°C
• Density: 8.5 g/cm³
• Flux system adjustable as per requirement
• High reliability for industrial soldering

40/60 (Sn40 Pb60)

Technical Highlights:
• Tin: 20% ±0.5%
• Lead: 80% ±0.5%
• Melting Point approx. 287°C
• Suitable for elevated temperature applications
• Stable metallurgical bonding

30/70 (Sn30 Pb70)

Designed for elevated temperature resistance and structural stability.

20/80 (Sn20 Pb80)

Technical Highlights:
• Tin: 20% ±0.5%
• Lead: 80% ±0.5%
• Melting Point approx. 287°C
• Suitable for elevated temperature applications
• Stable metallurgical bonding

95/5 (Sn95/Sb5)

High-temperature alloy engineered for enhanced strength and durability.

Trusted Excellence

Technical Performance Charateristics

Engineered to ensure metallurgical consistency, controlled impurity levels, and stable processing performance across industrial soldering applications.

Controlled Viscosity Stability

Consistent Metal Content Distribution

Spread Factor >95%

Total Impurity Level ≤ 0.08%

Adjustable Flux Content (0.9% – 3.5%)

Stable Reflow Performance

Material Safety Data Sheet (MSDS)

Storage & Handling Guidelines

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Need Custom Alloy or Bulk Supply?

Contact our technical team for detailed specifications, pricing, and bulk order inquiries.

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